No Cost Qualification !!!
MICRO RECLAIM TECHNOLOGIES LLC SILICON CARBIDE & GALLIUM NITRIDE RECLAIM
PROVIDING STATE OF THE ART RE-POLISHING SERVICES OF HIGH PERFORMANCE SEMICONDUCTOR WAFERS FOR EPITAXY RE-GROWTH
Applications
Electric Vehicles
Radar and Base Stations
Radar and Base Stations
Power semiconductors are ideal for applications such as on-board chargers and inverters used within plug-in hybrid and fully electric vehicles .
Radar and Base Stations
Radar and Base Stations
Radar and Base Stations
SiC and GaN offer many advantages in RF power and power-switching applications that require high voltage, high power density, and operation at high temperatures.
Renewable Energy
Radar and Base Stations
Renewable Energy
Power electronics are used in conversion units in wind generation systems .
About Us
COST SAVINGS
Recognizing the value of your non-conforming wafer by reclaiming will reduce your yield losses. Reclaimed wafers provide its greatest value when used in epi-reactor calibrations performed after maintenance events , source changes , and regular process monitoring. The same wafer can be cycled through multiple times, further reducing these costs.
STRONG CUSTOMER RELATIONS
MRT is committed to understand, meet and, when possible, exceed our Customer's Requirements through the continuous improvement of our processes. We are dedicated to performing reclaim services at the best quality and most competitive cost possible.
HIGH QUALITY SERVICE
MRT has worked closely with substrate manufacturers to develop an effective process yielding high quality , low Si-Face roughness ,epi-ready substrates. We offer epi removal, and re-polishing services on Semi-Insulating and N-Type Silicon Carbide wafers ranging in diameters from 2in, 3 in, 4in and 6in. We reclaim both 6H and 4H poly-types with either on-axis or off-axis surface orientations. MRT also offers re-polishing services on GaN ,and Sapphire wafers yielding an equally high quality surface finish.
Results
Polish and CMP reclaim processes yielding a low roughness ( Sa < 5A ) , epi-ready , scratch free surface , enabling epitaxial re-growth , thus reducing costs associated with yield loss.
Services
Semiconductor Wafers and Materials
2" , 3" , 4" and 6" Diameter wafers
Semi Insulating Silicon Carbide Wafers
N-Type Silicon Carbide Wafers
GALLIUM NITRIDE Wafers
Epitaxy & Thin Film Removal and CMP Re-Polish
GaN, AlGaN, AlN, and SiC epi removal and surface preparation for epi ready wafer
Device Wafer
Removal of metalization and and nitrides , remaining epitaxy , CMP
Epitaxial Wafer
Removal of epaitaxy , CMP
Back Side Polish
"Kiss" polish removal of residual material from back of Epitaxial Wafer with no damage to Epi Structure
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Back Side Polish - BSP
Defects on the backside of a wafer during epi growth can come from many sources. Residuals and scratches can be caused by handling equipment , robots and chucks , and also transferred from wafer carrier pockets . Backside defects can cause areas of poor lithography patterns on the front side of the wafer resulting in yield loss. We have worked with our customers to develop a non aggressive polishing process which not only removes the defect , but also does not affect the SBIR of the wafer , which is a very important parameter in small die fabrication.
Additional Services
Wafer Thinning
MRT provides state of the art wafer
wafer thinning services to manufacturers of semiconductor devices. Thinning is required for stacking and high-density I.C. packaging . Keeping the wafer uniformity is highly critical during this process. By utilizing our polishing technology ,final results yield thicknesses down to 50 um and TTV =/< 5um for 100mm Wafer.
